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News | Press release | Micro-nanotechnologies
GRENOBLE, France – April 13, 2023 – CEA-Leti will present seven papers on 3D interconnects focused primarily on semiconductor wafer-level platforms at the Electronic Components and Technology Conference (ECTC), May 30-June 2, in Orlando, Fla.
The institute is focusing on achieving high levels of heterogeneous integration of technologies and components on a host silicon wafer through high-density interconnections (fine pitch) to meet requirements of HPC/edge-AI chiplets, optical computing, displays and imagers. It offers a wide range of advanced, complementary technologies such as die-to-wafer and wafer-to-wafer bonding, whose interconnection densities are closely linked to TSVs to keep the densities for layer or ball-grid array (BGA) connections.
CEA-Leti's Stéphane Bernabé will co-chair the special session on Photonics Packaging, May 30 at 1:30 – 3:00 p.m.
In addition, a Best Poster award from ECTC 2022 will be awarded to Aurélia Plihon et al, for their poster: "Scalable Through Mold Interconnection Realization for Advanced Fan-Out Wafer-Level Packaging Applications".
CEA-Leti experts will be onsite at booth 234 and available to discuss the findings in the presentations.
Event's website: https://www.ectc.net/index.cfm
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.