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Article | Micro-nanoelectronics
Wireless Communication & Networks
Leti's RF Technologies in Front End Modules, Mm-wave connectivity and Backhauling are meeting 5G challenges
CEA-Leti, a CEA technology research institute, received the award in the Impact Delivered category for the development of a patented Smart Cut™ process of substrate fabrication in collaboration with SOITEC, which results in a transfer of a thin active layer of silicon from one substrate to another, which can be used in all electronic devices.
The future of telecom relies more than ever on the semiconductor industry. While previous generations relied on the continuity of pre-existing technologies to achieve absolute performance, 6G, as viewed by CEA-Leti, aims to adopt a new approach, combining energy frugality with performance.
GRENOBLE, France – Feb 9th, 2021 – CEA-Leti today announced a visionary EU 6G research project for next-generation wireless connectivity. Called RISE-6G, it will design, prototype and test smart and energy-sustainable technological advances based on reconfigurable intelligent surfaces (RIS) that will enable programmable control and shaping of the wireless propagation environment.
CEA-Leti's IWAT2020 award-winning research into miniaturized, frequency reconfigurable antennas for the IoT has already attracted several manufacturers.
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.