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innovation for industry
Don't miss the next digital event Efficient and frugal solutions for data deluge management
Dive into a societal revolution
CEA-Leti 50 years of pioneering innovation in miniaturization
Advancing Chip Design Through Cutting-Edge 3D Packaging Technologies
La caractérisation de nouveaux composants électroniques est essentielle à leur conception et, au final, pour garantir leur fiabilité. La 7ème édition du colloque Carac aura lieu le mardi 24 novembre 2020 en ligne sur la plateforme de webinaire de l’IRT Nanoelec (Act&Match). Cette édition fera la part belle aux gains de performance des très grands équipements disponibles dans le cadre programme Nanoelec/Caractérisation, à l’ESRF (désormais la source synchrotron la plus performante du monde), à l’ILL (réacteur nucléaire dédié à la recherche grâce aux neutrons) et au CNRS/LPSC
oin CEA-Leti in virtual mode for a remote discussion of key technologies for data-deluge management.
MiNaPAD, the « Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum » will be held in Grenoble, France, at the WTC congress center MiNaPAD is a 2 days conference with an exhibition. The aim of this event is to reinforce the design community (which constitutes the largest share of the semiconductor community in Europe) and the assembly and packaging community:
Discover our market solutions synonymous with competitiveness.
Successful products integrating innovations developed from our breakthrough technologies.
Visit the Leti Innovation Days website, our annual event.
Get to the heart of our technologies by viewing our videos.
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.
