To access all features of this site, you must enable Javascript. Here are the instructions for enabling Javascript in your web browser.
innovation for industry
News | Institutional
News
Liste de actualités du Leti
Perfectly-transparent piezoelectric materials could enable new high-performance haptic interfaces, groundbreaking products like smart and self-cleaning windows, and novel piezo transducers for photoacoustic imaging. Unfortunately, these materials are difficult to manufacture. CEA-Leti recently came up with innovations in both processes and materials that get around some of the issues plaguing PZT, one of today’s most commonly-used piezoelectric materials.
R&D Vision Includes Adapting Wireless Technology for Drones and Robots in Factories
CEA-Leti invites decision makers on the lookout for innovative and promising chip-based R&D, as well as editors, analysts and entrepreneurs to peruse the institute's reader-friendly "2023 Highlights" report
At CEA-Leti, researchers benefit from a rich ecosystem that facilitates sharing views around major societal challenges. Innovation also requires knowing how to inspire future talent. In Europe, Thomas Ernst is convinced that one of the challenges of decades to come will "involve mobilizing future generations around the new issues from the great ‘technological adventure".
The Epicool project is investigating the use of optics to cool epileptogenic areas in the brains of epilepsy patients resistant to other treatments. A prototype implantable device is currently being developed and will be miniaturized before animal testing begins.
MEMS and NEMS—micro- and nanoelectromechanical systems—are tiny devices like sensors, actuators, and micromirror arrays, with moving parts that are sensitive to a physical quantity like speed, pressure, or direction. They convert this physical quantity into an electrical signal, which can, in some cases, operate an integrated micro-actuator.
They are the hundreds of unit structures, ranging from 5 to 50 µm that can be seen on the surface of most insect eyes. These microlenses, which comprise an anti-reflective (AR) architecture, help a large amount of a light source converge toward photoreceptor cells, thus facilitating light trapping in dark environments. But that is not all, as these anti-reflective nanostructures also enable a surface's self-cleaning feature. For arthropods, this is a question of survival, while Raphaël sees it as a source of inspiration for improving energy efficiency in devices such as photovoltaic panels or imagers, which could greatly improve the trapping of light.
Toxicology-testing platform integrating immunocompetent in vitro/ex vivo modules with real-time sensing and machine learning based in silico models for life cycle assessment and SSbD
The photonixFAB project aims to empower photonics innovation by SMEs and large entities by providing low barrier access to both low-loss silicon nitride (SiN) and silicon-on-insulator (SOI) based photonics platforms with indium phosphide (InP) and lithium niobate (LNO) heterogenous integration capabilities.
Human and animal health and the environment are inextricably linked. CEA is developing enabling technologies to support an integrated approach that spans diagnostics, therapeutics, prevention, and monitoring.
Advanced 3D packaging is a complex technology that is expected to become increasingly important in packaging a wide range of electronic devices in various fields such as IoT, AI, or medical fields. Finding viable solutions to meet the growing global demand for new integration developments has therefore become relevant.
As the number of IoT connections continues to expand, new data communication link solutions will be needed to cope with the data deluge and enable a more sustainable digital (r)evolution.
The surge in nanoelectronics and photonics has resulted from a need for miniaturized tools and devices that are an integral part of our lives. Additionally, it has now become necessary to consider innovation through issues involving planetary resources and energy consumption. Because it is installed in miniaturized devices, silicon-based CMOS technology is now central to these issues. This presents significant challenges for reaching a low energy consumption that aligns with current societal preoccupations.
As embedded AI algorithms become more sophisticated, they also become more data intensive. In-memory computing dramatically reduces the power consumption associated with data transfer between memory and logic while helping keep data more secure. New non-volatile memory technologies that imitate the human brain’s energy-efficient synapses are also driving new low-power solutions. CEA develops and integrates all these technologies for a range of IoT projects.
As the limits of Moore’s Law approach, advanced chip packaging has emerged as a solution for continued scaling. CEA offers a complete chiplet and 3D integration toolkit enabling a modular “one to many” approach that speeds up the development of new solutions for automotive, high-performance computing,data centers, imaging, and more.
By launching the NextGen project, CEA aims to develop new generations of FD-SOI chips with better energy efficiency. It will ensure the capacity to engineer the most advanced components and maintain French and European microelectronics competitive for the future markets.
Vitesco Technologies, a leading international provider of modern powertrain technologies and electric mobility solutions, presents the first outcome of its partnership with the CEA in France: Together they have developed a “switched battery” (SWIBA) management technology that further improves the overall performance of the powertrain of electric vehicles.
Top page
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.