Since joining CEA-Leti in 2023, Mohammad Alsukour has been working on a PhD thesis at Grenoble Alpes University (UGA) and researching to optimize interconnections with the use of hybrid bonding at millimeter wave (mm‑Wave) frequencies to optimize interconnections, for 5G and future 6G communication systems, as well as radar systems.
After studying electrical engineering at the University of Jordan, he worked in various fields, including participating in a space research program supervised by NASA experts, where his interest in advanced technologies first emerged. After publishing several scientific papers, he relocated to Grenoble to follow an international master's degree in Wireless Integrated Circuits and Systems at UGA, specializing in the development of smart antennas.
His paper entitled “Die-to-Wafer Hybrid Bonding impact at mm-Wave frequencies" tackles the technical hurdles facing mm-Wave hybrid bonding, such as signal loss, capacity limits and the electrical resistance experienced by conventional interconnections at high frequencies.
The challenges facing nanoscale hybrid bonding
Hybrid bonding creates direct connections between chip and wafer, enabling higher density and superior performance, allowing multiple technology nodes to be combined. The next step is to optimize these connections through a process of simulation, manufacturing and testing. The main goal of Mohammad's research is to minimize losses associated with the millimeter-wave frequencies used in hybrid bonding.
“I am also optimizing these interconnections and proposing design rules for integrating active and passive components and for ensuring efficient functionalization of the hybrid bonding level for future high-frequency applications."
There have been a few obstacles along the way. Mohammad notably recalls facing “difficulties achieving precise nanoscale alignment and bonding, particularly at millimeter-wave frequencies, where components are very small. “Other parameters also posed technical problems, relating in particular to process compatibilities The team was able to overcome these challenges “by developing new simulation-based approaches, improving the bonding process and collaborating with experts at every stage. “
In collaboration with TiIMA and CEA experts, he developed prototypes that deliver significant improvements in signal integrity and performance at mm-wave frequencies.
“I can proudly say that these results validate our research and pave the way for advances in semiconductor technologies.”
These studies enable more efficient and reliable high-frequency operation of semiconductor devices, benefiting high-tech applications such as 5G and future 6G communication systems, as well as radar systems.
Mohammad's next goal is to fine-tune these hybrid bonding interconnections, explore their integration into complete semiconductor systems, and consolidate the process for mass production.