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CHIP-IN-FLEX

Published on 2 October 2020

First fully flexible label incorporating an RFID chip and sensors

 What is Chip-In-Flex?

  • Chip-In-Flex is CEA-Leti's latest development towards the integration of ultra-thin, bare silicon chips within a flexible film. Today, electronic systems are becoming smaller, thinner and, above all, flexible. Flexibility makes possible new functions and hence new usages. With Chip-In-Flex, CEA-Leti is introducing a new paradigm for integrating ultra-thin, bare chips into a flexible label made on a silicon wafer.


 Applications

  • The flexible label easily interfaces with an interconnection system printed directly on the object or on a larger flexible substrate. Curved surfaces, such as a dashboard, a steering wheel, piloting or driving controls, a smartphone shell, etc., can therefore be functionalized. Integration of electronic systems applied to fabrics or personal patches for medical or well-being applications is also envisaged.



 What's new?

  • Fabricated at CEA-Leti, this demonstrator leverages an RFID chip featuring temperature and stress sensors, all integrated into an ultra-thin, flexible label developed by the Institute. The latter is applied to a flexible substrate featuring an antenna leveraging low-cost printing technologies developed by CEA-Liten. An RFID testing system enabled successful validation of the demonstrator's functionality.


 What's next?

CEA-Leti’s team is continuing to improve the integration process and produce ever smaller, higher performance labels.


Publications

  •  J.-C. Souriau et al.,
    69th Electronic Components
    and Technology Conference
    (ECTC), 2019


  • J-C. Souriau et al.
    ChipScaleReview, September-
    October; Volume 23, Number 5



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(252 Ko)