innovation for industry
News | Press release
During this 2-year Coordination and Support Action project starting on 1st July 2020, European industry and R&D leaders from both the microelectronics and telecommunications sectors will jointly develop a high-level strategic roadmap of core technologies for future connectivity systems and components, targeting the next generation telecommunications networks and services.
This roadmap will provide the foundations for
a sustainable European technology sovereignty in 5G and beyond. It will
promote innovation and business opportunities, including for small and
medium-sized enterprises (SMEs), and contribute to build or reinforce
European leadership in these areas. It will cover the full 5G value chain
including materials, components, subsystem integration, connectivity platforms
and will address vertical industry sectors in areas such as health, energy,
manufacturing, automotive and smart cities, among others.
Over the next ten years, 5G and then 6G are expected to connect billions of devices, digitise industries, and bring social and economic advances in many vertical sectors. Developing the necessary core technologies is crucial for Europe to decrease its dependence on non-European technologies. By bringing together the microelectronics industry (electronic chip makers) and the telecommunications industry, COREnect will support the necessary coordinated and concrete actions to be taken in Europe.
The COREnect consortium involves prominent European industrial and academia players from the telecommunications sector (Ericsson, III-V Lab / Nokia, and Technische Universität Dresden/ Barkhausen Institut), from the microelectronics sector (Infineon, NXP, STMicroelectronics, imec and CEA), industrial associations representing the Smart Networks and Services and Key Digital Technologies communities (5G IA and AENEAS), a leading industry player in one of the vertical markets for 5G (Bosch), and one of the major promoters of the European SME ICT community (AUSTRALO).
COREnect has the potential to significantly impact European research and innovation (R&I) and the industry landscape of future connectivity systems, strengthening Europe's position in the global digital scene. Among its activities, the COREnect project will conduct a comprehensive landscape and impact analysis, encompassing the whole value chain from microelectronics ecosystems to the design of future connectivity platforms at system level and vertical applications. The definition of the strategic roadmap will involve three expert groups, supported by COREnect workshops and community building, ensuring coordination among industry and academia actors.
In addition, the consortium will reach out to communities in related fields such as High-Performance Computing, Artificial Intelligence, Photonics, Internet of Things and Cloud Computing. The overall vision and strategy will be published on the COREnect website, and the project will communicate extensively with national and international target groups throughout industry and wider society.
Members: CEA-Leti, Imec, Technische Universität Dresden/Barkhausen Institut, 5G IA, III-V Lab , Nokia, AENEAS, Australo, Bosch, Ericsson AB, Infineon, NXP Semiconductors N.V, STMicroelectronics.
This project has received funding from the European Union's Horizon 2020 research and innovation programme under grant agreement N° 956830
More information on the website
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.