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Liste de actualités du Leti
on the Minatec Campus, the System Division gathers over 300 high level researchers and engineers. This division is at the strategic core of CEA-Leti’s technological innovation and aims to provide a global and valuable “system perspective” on technological trends. Our’s expertise is based on four major pillars which are (i) wireless communications, (ii) innovative sensor-system design, (iii) power management and electronics for energy and (iv) security solutions for electronic systems and components. Its teams are using tools and know-hows inherited from the physics, electromagnetism and electronic areas as well as from the signal and data processing domains; additionally, they have access to state-of-the-art facilities for the simulation, characterization and prototyping of complex electronic systems.
CEA-Leti has demonstrated record performance in top-tier nMOSFETs using the institute’s 3D low-temperature (LT) sequential integration technology, CoolCubeTM.
CEA-Leti today announced that it has collaborated with Siemens Digital Industries Software to offer an updated process design kit (PDK) that enables photonic designers to select multiple methodologies, including layout centric, schematic driven and layout automation and provides access to CEA-Leti’s 300mm photonics multi-project wafers (MPW).
The MYCUBE project aims to offer, for the first time, a powerful viable technological solution to intensive memory-based computation. It is based on new nano-functionalities created by proximity of silicon nanowire transistors and non-volatile resistive memories integrated in 3D. Research work is cross-disciplinary and ranges from application to technological implementation including circuitry. A typical «In-Memory-Computing» accelerator circuit will be designed and manufactured at CEA-Leti, enhancing energy performance by a factor of 20 compared with a state-of-the-art Von-Neumann circuit.
“Hardware is back” is the theme of the upcoming Leti Innovation Days with STMicroelectronics and Intel Corporation on June 22, 2021. The need to focus on innovations in hardware is more pressing than ever given the exponential increase in the energy consumption of systems expected in the coming years.
CESTI, the IT security testing center at CEA-Leti, has already earned a strong reputation for its expertise in the security of electronic components and devices. It is now the first testing center in France to certify biometric identification solutions. The first-ever certification was granted following an audit completed in partnership with testing lab ELITT.
GRENOBLE, France – May 31, 2021 – Armed with exclusive access to 11 CEA-Leti patents covering specialties such as DNA extraction and microscopic-sample diagnostics, CEA-Leti startup Direct Analysis has developed a pathogenic-bacteria-detection system for food manufacturers that takes one-fourth of the time of existing tests, can minimize stoppage of production lines and reduce food-product recalls and losses.
Low-Cost Gb/s Connectivity Overcomes Limits of Copper Wire and Optical Fiber for Automotive, Aeronautics, Telecom, Industry 4.0 and Healthcare Uses
With the theme “hardware is back”, CEA-Leti will host its annual Leti Innovation Days digitally on June 22 and 23.
A proof-of-concept prototype of a low-cost, compact, wearable tissue oxygenation sensor was developed by CEA-Leti, a CEA Tech institute. A clinical trial demonstrated the device’s effectiveness at monitoring tissue oxygenation.
CEA-Leti today announced the world’s first autonomous imager technology that activates smartphones and small appliances through face recognition or other specific patterns. Called µWAI (micro-WAY) and sized as small as a 1€ coin, the autonomous imager features a novel readout and processing architecture co-designed with an optimized algorithmic pipeline
CEA-Irig was among the partners on a French national research agency (ANR) project that resulted in the on-demand emission of single photons in silicon at 1.28 µm, a wavelength used in telecommunications. They did it by introducing carefully-engineered defects into the material. The goal is to integrate this photon source into CEA-Leti chips for quantum communications.
ASCENT+ mobilises an unprecedented network of knowledge and investment to open access to key European infrastructures and enable academic and industry researchers to address emerging challenges in Nanoelectronics and to accelerate innovation path-finding.ASCENT+ brings together 15 partners to make world-class facilities available and to foster the Nanoelectronics community. ASCENT+ integrates a unique research infrastructure with outstanding credentials. The partners' facilities at CEA-Leti (FR), Fraunhofer Mikroelekronik (DE), imec (BE), INL (PT/ES) and Tyndall (IE) combine research infrastructure and expertise offering an extensive portfolio to state-of-the-art processing, modelling and data sets, metrology and characterisation, and devices and test structures for Nanoelectronics
The strategy adopted for protecting pancreatic islets from immune rejection is to microencapsulate them in soft, porous, biocompatible microcapsules. CEA-Leti was project coordinator and leader for microcapsule production, characterisation, dissemination and planned usage.
SAFESTRIP aims to integrate new sensor and communication technologies into lowcost, integrated strip markers on the road. This system will provide personalized in-vehicle messages for all road users at reduced maintenance cost. It incorporates full recyclability and real-time predictive road maintenance functions.
Development of autonomous, connected cars may be hampered by the fact that potential buyers do not trust them to be secure. The SECREDAS project is dedicated to taking a huge step involving the safety, security and privacy of these future vehicles.
5G is expected to allow much higher throughputs than 4G. Using the WiFi band as a complement to 5G is planned to boost transmission speed on both 5G and WiFi bands. The SPEED-5G focuses on how these frequency bands can be shared and develops the necessary building blocks to optimize throughput in very dense network deployments.
The INNPAPER project is aimed at creating configurable, recyclable common platform that integrates a variety of paper-based electronic devices into a multifunctional paper sheet to allow subsequent production of multiple use cases. The ultimate aim of the project is to demonstrate the feasibility of the paper-based common electronic platform, on which paper is used as both the substrate and the active component, by developing real use cases (smart labels and PoC bioplatforms). The paper-based common electronic platform and its resulting use case demonstrators will be manufactured on a multi-site pilot line at the INNPAPER consortium’s multidisciplinary partner facilities.
CEA-Leti is developing a method to diagnose head trauma using light. The amount of blood in the body can be measured using red light, so we are designing a device to installed in hospitals to measure head trauma severity
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CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.