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Advanced 3D packaging is a complex technology that is expected to become increasingly important in packaging a wide range of electronic devices in various fields such as IoT, AI, or medical fields. Finding viable solutions to meet the growing global demand for new integration developments has therefore become relevant.
After completing an #engineering school in materials and a 5-year experience abroad, Aurélia joined CEA-Leti intending to work on integrating innovative 3D packaging processes, in particular Fan Out Wafer-Level Packaging (FOWLP). FOWLP involves rebuilding wafers from different chips that can be placed one on top of the other, all molded from a silica-filled epoxy (EMC: Epoxy Molding Compound). Vertical interconnections, called TMI (Through Molding Interconnection), were developed to link the chips together. She was awarded for developing a simple integration of these TMIs.
With these results, Aurélia offers a simple solution for achieving state-of-the-art high aspect ratio vertical interconnects. It will make it possible to develop more complex integrations with a high density in FOWLP applications.
Paper: click here
Acknowledgements: Perceval Coudrain
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.