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CEA-Leti @SPIE Advanced Lithography + Patterning

From 2/25/2024 to 2/29/2024
San Jose, California, United States

​​​​​​​​​​​​​​​​​​Join SPIE Advanced Lithography + Patterning; the event for emerging technology in the semiconductor industry from 25 - 29 February 2024, in San Jose California, Convention Center. Join Leti and other leading researchers who are solving challenges in optical and EUV lithography, patterning technologies, DTCO and Computational Patterning, metrology, and process integration for semiconductor manufacturing and adjacent applications…

CEA-​Leti are inv​olved in 9 proceedings:


​Time & Place



February 27​​​

5:00 PM - 5:20 PM PST | Convention Center, Room 210A​

​Characterization and mitigation of local wafer deformations introduced by direct wafer-to-wafer bo​nding​​

Richard J. F. van Haren, Suwen Li, Mart Baars, Blandine Minghetti, Leon van Dijk, Ivanie Mendes, Karine Abadie, Marie-Line Pourteau, Gaelle Mauguen, Michael May, Viorel Balan, Frank Fournel, Laurent Pain, Thomas Plach, Gernot Probst, Markus Wimplinger​

4:45 PM - 5:05 PM PST | Convention Center, Room 211B​​

​Understanding plasma etching of grayscale microlenses​ and multi-height structures for optoelectronic devices​​​

Assia Selmouni, Aurélien Tavernier, Api Warsono, Sébastien Bérard-Bergery, Nicolas Posseme​​

February 28​​​

5:30 PM - 7:00 PM PST | Convention Center, Hall 2​​ ​

​Manu​facturing of 3D submicronic struct​ures at wafer scale​​​​​

Diana Fernandez Rodas, Jérôme Rêche, Raluca Tiron, Ivanie Mendes ​​

​5:30 PM - 7:00 PM PST | Convention Center, Hall 2​​ 

​Fabrication of​ 3D microstructures by controlled bending of suspended microdisks​

Raphaël Feougier, Abdelkader Aliane, Aurélien Sarrazin, Zouhir Mehrez, Nicolas Posseme, Raluca Tiron​

5:30 PM - 7:00 PM PST | Convention Center, Hall 2​​ ​​

​Small angle x-ray scattering overlay metrology for advanced nodes​​​

Timothée Choisnet, Guillaume Freychet, Yoann Blancquaert, Patrice Gergaud​​

​​5:30 PM - 7:00 PM PST | Convention Center, Hall 2​​ 

Impact of process parameters on grayscale MEEF

Ujwol Palanchoke, Florian Tomaso, Yorrick Exbrayat, Gaby Bélot, Marie-Line Pourteau, Ivanie Mendes, Juline Saugnier, Aurélien Fay, Sébastien Bérard-Bergery, Elodie Sungauer, Charlotte Beylier, Rémi Coquand, Arthur Bernadac

February 29

​​9:20 AM - 9:40 AM PST | Convention Center, Grand Ballroom 220C​​ ​​​

Life Cycle Assessment of etching processes for FDSOI transistors  technologies

Mickael Renaud, Aurélien Sarrazin, Joao Lopes-Barbosa, Yannick Rivoira, Isabelle Servin, François Boulard​

​​11:15 AM - 11: 35 AM PST I Convention Center, Room 210C​

​A deep learning workflow to generate free-form masks for grayscale lithography

​Merlin Moreau, Jean-Baptiste Henry, Stéphane Bonnet​


Practical information

Dates: 25 February - 29 February 2024

Location: San Jose, California, United States​

Website:  click here

Technical program: click here

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