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Leti Innovation Day Taiwan 2024

From 4/9/2024 to 4/9/2024
Hsinchu, Taiwan



Join CEA-Leti CEO Sébastien Dauvé and a panel of tech experts
at Leti​ Innovation Day Taiwan in Hsinchu on April 9, 2024

Global semiconductor R&D leader CEA-Leti is bridging the gap between lab and fab as the partner of choice for innovative businesses seeking a one-stop-shop for their advanced technology R&D needs.
​CEA-Leti R&D partners benefit from the institute’s state-of-the-art R&D facilities
​​and proven technology transfer program.

Don’t miss this opportunity to meet with CEA-Leti and partners and explore the potential
​for R&D partnerships in Taiwan.

This event is organized in collaboration with SEMI and the French Office in Taipei, which is the official
​representation of France in Taiwan and is strongly involved to foster cooperation
​in all fields,  ​including semiconductors.


A keynote speech will be given by Pierre Barnabé, CEO, Soitec
One of CEA-Leti’s most emblematic spinoffs, Soitec is today among the world’s top suppliers of innovative semiconductor materials.
​Soitec CEO Pierre Barnabé will talk about how the company is addressing sustainability, one of the key challenges of our times.​​

Franck Paris
Director of the French Office
in Taipei
Sébastien Dauvé

 Tuo-Hung Alex Hou
Director General TSRI,
Chair Professor NYCU

Clark Tseng
Sr. Director of Market Intelligence​,
 Martin Gallezot
Semiconductor Technologies Partnerships Manager, CEA-Leti,

Sylvie Joly
3D Integration and Bonding Division, ​
Benoit Charbonnier
Optics and Photonics Division,
Michael Tchagaspanian
EVP, Strategic Partnerships,
Olivier Thomas
​Deputy Head of the Integrated Circuit & System Division,


2:00 p.m. - 4:30 p.m.
Explore a spectrum of topics through engaging presentations:

Semiconductor market trends

Innovative semiconductor materials,
the key to a sustainable future

CEA-Leti partner success stories

Trends in emerging non-volatile memories

CMOS-compatible silicon photonics for high-performance computing and data transmission

Advanced CMOS and memory-based technologies for more sustainable computing systems

Innovative RF technologies for next-generation telecommunications 

Innovative solutions for advanced 3D packaging

Innovative digital processing architectures for next-generation electronics

Partnering with CEA-Leti​

​​​4:30 p.m. - 5:30 p.m.
Networking reception with CEA-Leti's management and experts

Leti Innovation Days Taiwan 2024 is organized by CEA-Leti

in conjunction with


For more information, please contact Evelyne Etchebehere

 Supported by Carnot network of French RTOs


Practical information

Practical information

Workshop: 2:00 p.m. – 4:30 p.m.
Networking reception: 4:30 p.m. – 5:30 p.m.
Contact: with any questions.
​​In-person event.

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