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Leti @Embedded World 2018

From 2/27/2018 to 3/1/2018
Exhibition Center, Nuremberg, GERMANY

Discover Leti fusion-sensor solutions for self-driving cars and drones @ Infineon booth and ST Microlectronics booth.
​Leti will present two low-power fusion-sensor solutions for robotics — cars, drones, robots — this year at Embedded World 2018, the world's largest tradeshow for embedded technologies.

The institute will showcase its SigmaFusion™ multi-patent technology, an embedded data-fusion solution that enables environment perception in autonomous vehicles at Infineon booth, Hall 3A/3A-231

Leti will also present 360Fusion, the first low-power 3D fusion-sensor solution that can be embedded in drones, at ST Microlectronics booth, Hall 4A / 4A-238.

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