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CEA@CES 2021

From 1/11/2021 to 1/14/2021
Digital event

​From January 11 to 14, 2021, the CEA will participate in the Consumer Electronic Show (CES) for the 7th consecutive year. 

For this 100% digital version, the CEA is supporting 3 spin off start-ups from its laboratories that have developed technological solutions in response to three major societal challenges: 

  • The energy transition, with Wise-Integration, which will present the world's smallest charger for electric bicycles,

  • The digital transition with Alkalee, which has developed a software suite equipped to bring agility and openness to the vehicles of tomorrow,

  • And the health of the future, with iUMTEK for rapid quantitative and qualitative diagnosis of air pollution.

Come and discover them on the CES 2021 website. Access is free, we are waiting for you. 



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  • 14 May
    8h30-15h30      Semiconductor Deep Tech Day 2024

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    See some of the latest semiconductor technologies in action and network with industry professionals at this Bay Area event. You’ll come away with new ideas about how to put the latest technological advances to work for your innovative products and solutions!

  • 28 May au 31 May CEA-Leti-@ECTC-2024

    Denver, Colorado, USA

    RENOBLE, France – April 23, 2024 – CEA-Leti will present seven papers and one poster on its latest developments in microelectronics packaging, including three covering 3-layer integration, at the Electronic Components and Technology Conference (ECTC), May 28-31, in Denver. A pioneer in FD-SOI technology, the institute is at the forefront of heterogeneous 3D integration and enables the combination of More Moore and More than Moore technologies. 3D integration and advanced packaging technologies are becoming mainstream for modular, high-bandwidth, low power consumption and efficient system architectures from consumer and automotive applications to high performance computing (HPC) and edge AI multi-layer smart imagers developed in the frame of IRT Nanoelec. From high-density interconnection (fine pitch hybrid bonding DtoW and WtoW) to ultra-thin stacking layer interconnection with high density TSV and low temperature process, CEA-Leti is pushing the limits of 3D integration. It also is preparing the next generation of quantum computing with a complete set of packaging technologies. ​

  • 25 Jun au 27 Jun Leti Innovation Days 2024

    Event |  Maison Minatec, Grenoble, France

    The world needs lower-power, more resource-efficient electronics for a array of use cases, and the semiconductor industry is understandably excited about the recent surge in investments. This is good news for the industry—and it will create unprecedented opportunities.

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