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Article | High performance computing
Taking up tomorrow's computing challenges in a connected world: maintaining performance progress while curtailing power consumption.
New computing technologies
GRENOBLE, France – April 2, 2020 – L-UTSOI, a “compact model” dedicated to FD-SOI technologies and developed by CEA-Leti, has been selected as a standard model by the Compact Model Coalition (CMC), a working group composed of the major semiconductor companies and part of the Silicon Integration Initiative (Si2).
Kalray, which completed its IPO last year, recently signed a distribution contract that will bring its intensive computing solutions for artificial intelligence to the rapidly-growing Chinese market
The demo enables massively parallel, low-power and low-latency computation abd will be demonstrated at Flash Memory Summit 2019, August 6-8.
CEA-Leti and Stanford University have developed the world’s first circuit integrating multiple-bit non-volatile memory (NVM) technology called Resistive RAM (RRAM) with silicon computing units, as well as new memory resiliency features that provide 2.3-times the capacity of existing RRAM. Target applications include energy-efficient, smart-sensor nodes to support artificial intelligence on the Internet of Things, or “edge AI”.
CEA-Leti today announced during IEDM an extension of its 300mm silicon-based wafer line to open new R&D avenues for its industrial partners.
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.