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Research Platform

12" Nanoelectronics Platform

The 300 mm nanoelectronics platform develops advanced transistors, integrated circuits and non-volatile memory. It is also where FD-SOI—today used to mass-produce chips worldwide—was born. The platform also conducts 3D integration R&D.

Published on 10 July 2017

​High added value modules and international R&D partnerships

The 12" nanoelectronics platform develops advanced transistors, integrated circuits and non-volatile memory. It is also where FD-SOI—today used to mass-produce chips worldwide—was born. The platform also conducts 3D integration R&D.

The platform’s scope embraces simulation, technology development, demonstrators and prototyping, advanced characterization and reliability testing. The platform can also conduct short-loop, proof-of-concept testing with wafer manufacturing sites. Foundries, fabless manufacturers, integrators, and materials and equipment manufacturing partners of the platform benefit from high-added-value modules offering excellent energy consumption, speed and frequency. This is ideal for the microcontrollers used in the automotive and medical industries and for smart cards among many other applications. The platform is one of the world’s top five 300 mm nanoelectronics R&D centers and operates in 15 strategic partnerships with organizations in the US and Europe. The platform is also home to advanced know-how in e-beam lithography, a potential alternative to optical lithography in achieving ultimate resolution. 

More information about the FDSOI technology and its possible applications


KEY FIGURES:
  • Open 24-7 3,300 sq. m of clean rooms
  • 200 research scientists and technicians 
  • 70 patents filed per year
  • €25 million annual investment 
R&D AREAS:
300 mm front-end modules and 3D integration

NOTABLE EQUIPMENT:
100 heavy machines and instruments 
LOCATION:
Leti (Grenoble)