innovation for industry
Execution Relies on CEA-Leti’s Fully Implemented Technology with Module-Level Innovations & Devices and Their Architectures
SAN FRANCISCO, CA – Dec. 3, 2018 – Leti, a research institute at CEA Tech, today announced during IEDM an extension of its 300mm silicon-based wafer line to open new R&D avenues for its industrial partners. This extension will allow new innovative technological modules to be inserted in, or made compatible with, industrial flows up to completely pioneered technology routes that enable edge AI, HPC, in memory computing, photonics, power electronics and other high-end applications.
“Our 300mm line will help Leti continue this strategy by accessing dimensions that make it possible to address the pressing challenges associated with emerging technologies, such as quantum, nanowires and sequential 3D integration,” said Emmanuel Sabonnadière, CEA-Leti CEO. “CEA-Leti’s industrial partners are now able to develop or test their disruptive technologies and their designs on state-of-the-art equipment, while benefiting from the institute’s R&D expertise, to achieve improved component performance, direct comparison with the ecosystem and easier technology transfers from lab to fab.”
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.