innovation for industry
From 9/25/2019 to 9/27/2019
WTC World Trade Center, Grenoble, France
Join both Semi European Imaging & Sensor Summits to be held on Sept. 25-27, 2019 in Grenoble, France to discover the latest available R&D and applications.
Guests will enjoy a series of keynotes on various hot topics, from automotive to healthcare/medical or industrial applications involving development and integration of MEMS and sensor technologies for autonomous systems for transportation and agriculture, cellular security systems, mixed reality (MR) headsets and biomedical wearables.
Leti will also be present on a dedicated stand to present its latest results in advanced sensor developments as well as to present the Pixcurve imager demo.
Laurent Malier, Head of Technology Design Platform Development, STMicroelectronics will give a talk on "From Image Capture to 3D Environment Sensing"
David Henry, Head of Packaging and Assembly Laboratory, Optics and Photonics Division, Leti
Session 5: Image Sensors | Thurday, September 26th , 2019 15h10
Minatec, Grenoble, France
Parvis des sciences, Grenoble, France
For the twelfth consecutive year, the GIANT campus and its partners in Grenoble are mobilizing and organizing the 2019 Science Fair: Saturday, October 12 for the general public free entry and from October 10 to 11 for schoolchildren in Minatec, Parvis Louis Néel in Grenoble.
3 parvis Louis Néel 38054 Grenoble cedex 9 - MINATEC - Grenoble, France.
Are you ready to Embrace the World ?
Ever-increasing demands and expectations for semiconductor technology are matched only by the opportunities they present throughout the supply chain – and for end users. Next summer, CEA-Leti will offer a preview of what is in store for the next tech generation that will drive our future.
Explore coming innovations in semiconductors that will enable smart sensing, local processing, haptics, advanced imaging, smart power management, and new communication technologies.
WTC - Congress center 5-7, place Robert Schuman - Grenoble, France.
MiNaPAD, the « Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum » will be held in Grenoble, France, at the WTC congress center MiNaPAD is a 2 days conference with an exhibition. The aim of this event is to reinforce the design community (which constitutes the largest share of the semiconductor community in Europe) and the assembly and packaging community:
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.