innovation for industry
From 12/3/2018 to 12/5/2018
Hilton San Francisco Union Square, San Francisco California
CEA-Leti Presenting 11 Papers at IEDM 2018
With more than 11 papers accepted, Leti will present major scientific results this year at IEDM on Dec 3 - 5, 2018, including in N&MEMS, 3D sequential technologies, resistive memories, scalable quantum computing, among others.
Session 7.2: Breakthroughs in 3D Sequential TechnologyTime: 2:00 pmLocation: Continental Ballroom 5
Session 6.2: Towards Scalable Silicon Quantum Computing (invited)Time: 2:00 pmLocation: Continental Ballroom 5
Session 7.3: Hybrid Bonding for 3D Stacked Image Sensors: Impact of Pitch Shrinkage on Interconnect RobustnessTime: 2:25 pmLocation: Continental Ballroom 6
Session 12.4: Very Large Scale Integration Optomechanics: A Cure for Loneliness of NEMS Resonators?Time: 9:00 amContinental Ballroom 1-3
Session 17.1 Characterization Methodology and Physical Compact Modeling of in-Wafer Global and Local VariabilityTime: 9:05 amLocation: Plaza B
Session 17.6: Development of X-ray Photoelectron Spectroscopy Under Bias and its Application to Determine Band-energies and Dipoles in the HKMG StackTime: 11:35 amLocation: Plaza B
Session 20.3: In-depth Characterization of Resistive Memory-based Ternary Content Addressable MemoriesTime: 3:10 pmLocation: Continental Ballroom 4
Session 21.3: Tunability of Parasitic Channel in Gate-All-Around Stacked NanosheetsTime: 3:10 pmLocation: Continental Ballroom 5
Session 18.4: Truly Innovative 28nm FDSOI Technology for Automotive Micro-Controller Applications Embedding 16MB Phase Change Memory Time: 4:00 pmLocation: Grand Ballroom B
Session 20.6: In-Memory and Error-Immune Differential RRAM Implementation of Binarized Deep Neural NetworksTime: 4:50 pmLocation: Continental Ballroom 4
Session 37.4: Optimized Reading Window for Crossbar Arrays Thanks to Ge-Se-Sb-N-based OTS SelectorsTime: 2:50 pmLocation: Continental Ballroom 4
Las Vegas, NV, USA.
Join ECTC, the premier international conference on microelectronic packaging, components, and systems technology from May 28 -31, in Las Vegas, Cosmopolitan Hotel. Join Leti at booth 215;
BIO International Convention is back in Philadelphia, June 3-6, to celebrate history-making innovation. This unique event attracts 16,000+ biotechnology and pharma leaders from 67 countries. Discover the next generation of cutting-edge products, therapies, and cures at events at BIO 2019.
CEA Leti, Minatec Campus, Grenoble, France.
Deep Tech for Edge Artificial Intelligence
The world won’t wait for the Cloud… neither should you. Distributed intelligence everywhere is the next big thing for industry and society, and IT'S TIME TO STEP IN.
Estrel Congress Center, Room 4 (upstairs), Berlin, Germany.
Advances in MEMS. Leti is pleased to invite you to its MEMS Workshop, a technical program presented in conjunction with 2019 Transducers/Eurosensors.
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.