innovation for industry
From 12/4/2017 to 12/6/2017
Hilton San Francisco Union Square, San Francisco California
SAVE THE DATE!
Leti will present 11 papers at IEDM Conference 2017 in San Francisco, Dec. 2-6, including three invited papers on 3D sequential integration, advanced memory solutions and stacked nanowires FETs. It also will host a workshop covering "Pioneering Technologies for More than Moore" on Dec. 3, anchored by a keynote talk from GlobalFoundries executive John Pellerin. Check out our workshop program here.
This year, Leti's scientific papers include:
1:35 pm - Session 3.1: "3D Sequential Integration: Application-driven technological achievements and guidelines" (Invited) Location: Grand Ballroom B
2:25 pm - Session 2.3: "In-depth investigation of programming and reading operations in RRAM cells integrated with Ovonic Threshold Switching (OTS) selectors" Location: Grand Ballroom B
4:05 pm - Session 7.6: "Thermal effects in 3D sequential technology" Location: Continental Ballroom 6
10:45 am - Session 16.5: "Industrialised SPAD in 40 nm Technology" Location: Continental Ballroom 7-9
11:35 AM - Session 14.6: "Improvement of HfO2 based RRAM array performances by local Si implantation" Location: Continental Ballroom 5
2:05 pm - Session 24.1: "Hybrid III-V/Si DFB laser integration on a 200 mm fully CMOS-compatible silicon photonics platform" Location: Continental Ballroom 6
2:55 pm - Session 20.3: "Design Technology Co-Optimization of 3D-monolithic standard cells and SRAM exploiting dynamic back-bias for ultra-low-voltage operation" Location: Grand Ballroom B
3:40 pm - Session 19.4: "Advanced memory solutions for emerging circuits and systems" (Invited) Location: Grand Ballroom A
9:30 am - Session 29.2: "Performance and Design Considerations for Gate-All-Around Stacked-NanoWires FETs" (Invited) Location: Grand Ballroom B
9:30 am - Session 32.2 "High performance low temperature FinFET with DPSER, gate last and Self Aligned Contact for 3D sequential integration" Location: Continental Ballroom 4
9:55 am - Session 34.3: "Developments in 300mm silicon photonics using traditional CMOS fabrication methods and materials (Invited)" Location: Imperial Ballroom B
No. 1, Jingmao 2nd Road, Nangang District, Taipei City, Taïwan 115.
For the second consecutive year, CEA-Leti will host a booth at Semicon Taiwan, September 18-20, TWTC Nagang Hal, Taipei @Booth L1022 , Hall 4F.
Join CEA-Leti's team to discuss your wafer, high performance computing, edge AI and beyond 5G technology needs.
Parvis des sciences, Grenoble, France
For the twelfth consecutive year, the GIANT campus and its partners in Grenoble are mobilizing and organizing the 2019 Science Fair: Saturday, October 12 for the general public free entry and from October 10 to 11 for schoolchildren in Minatec, Parvis Louis Néel in Grenoble.
Espace Champerret, Paris, France
Looking for an R&D partner to get started on your innovation project or bring your project to maturity?
RENDEZ-VOUS CARNOT 2019 is made for you! This event brings together 38 French research institutes dedicated to large, medium and small enterprises. Join Leti Booth and learn more about the institute R&D offer for industry.
Keio Plaza Hotel, Tokyo, JAPAN & Hsinchu Science Park, Hsinchu, TAIWAN.
Cea-Leti organizes the Leti Days Asia from October, 16th to 18th at Taiwan and Tokyo.
Meet Leti and his partner VNano at CPhI and discover ou partnership on Lipidots® technology, versatile and biocompatible lipid-based delivery system nanoparticles for bio-medical applications.
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.