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Leti @ Semicon West 2018

From 7/10/2018 to 7/12/2018
San Francisco, California


SEMICON West connects the entire extended microelectronics supply chain — including R&D institutes like Leti, a supplier of Innovation (R&D) in materials, equipment, design, manufacturing, system integration, MEMS, Sensors, etc. 
Join Leti to discover the institute latest “More Moore” and “More than Moore” technologies and discuss your business needs:

  • Attend Leti's live presentation by Severine Cheramy on Scaling Technologies: 
Thursday, July 12, 2018: 2:00PM-4:00PM - Moscone Center South Hall - TechXPOT South stage. 

Description: The announcement of a 5nm silicon chip using horizontal gate-all-around transistors mid-2017 is just one more indication that the industry will continue some form of “traditional” scaling as long as possible combined with 3D architectures. Along with this scenario, we also see a kind of “scaling” enabled by 3D IC technologies, such as die stacking, and the benefits/challenges of stacking very small geometry wafers. Also important to continue “scaling” will be interconnect scaling. This session will provide an update on how “scaling” continues to evolve and how the various players (foundry, IDM, fabless, and application developers) are jockeying for a leadership position with respect to innovation.  

  • Attend LETI WORKSHOP@Semicon West 2018Program and Registration HERE. 


Practical information

Booth 2017, European Pavillon South Hall
Moscone North
747 Howard Street
San Francisco, CA  


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