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RENOBLE, France – April 23, 2024 – CEA-Leti will present seven papers and one poster on its latest developments in microelectronics packaging, including three covering 3-layer integration, at the Electronic Components and Technology Conference (ECTC), May 28-31, in Denver. A pioneer in FD-SOI technology, the institute is at the forefront of heterogeneous 3D integration and enables the combination of More Moore and More than Moore technologies. 3D integration and advanced packaging technologies are becoming mainstream for modular, high-bandwidth, low power consumption and efficient system architectures from consumer and automotive applications to high performance computing (HPC) and edge AI multi-layer smart imagers developed in the frame of IRT Nanoelec. From high-density interconnection (fine pitch hybrid bonding DtoW and WtoW) to ultra-thin stacking layer interconnection with high density TSV and low temperature process, CEA-Leti is pushing the limits of 3D integration. It also is preparing the next generation of quantum computing with a complete set of packaging technologies.
The world needs lower-power, more resource-efficient electronics for a array of use cases, and the semiconductor industry is understandably excited about the recent surge in investments. This is good news for the industry—and it will create unprecedented opportunities.
CEA-Leti is setting up a novel R&D prototyping pilot line that aims to combine efficient computing solutions, FD-SOI and derivative architectures for More than Moore applications in areas such as healthcare, photonics and radio-frequencies.
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CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.