innovation for industry
From 6/11/2019 to 6/12/2019
CEA Leti, Minatec Campus, Grenoble, France.
Leti is hosting the 18th MUT workshop that will take place on June 11th and 12th 2019.
Initiated in 2001, the MUT (Micromachined Ultrasonic Transducers) workshop has taken place almost every year, in various cities across Europe. MUT gathers researchers and engineers from all over the world to exchange knowledge, ideas, results and perspectives on this new and attractive field.
Leti is developing ultrasonic transducers technologies (either CMUT-capacitive or PMUT-piezoelectric) to address new applications.
MUT devices exhibit excellent bandwidth characteristics, design flexibility, electronics integration and, potentially low cost solutions in a wide range of markets. Such devices offer a promising alternative to conventional piezoelectric transducers for various medical and industrial applications.
The 18th MUT workshop will take place on June 11th and 12th 2019 and will be hosted by CEA Leti, Minatec Campus, Grenoble (France).
Papers are solicited for oral presentations describing original work in the field of micromachined ultrasonic transducers in the following topics :
oin CEA-Leti in virtual mode for a remote discussion of key technologies for data-deluge management.
CEA-Leti will unveil its latest scientific results in 3D sequential integration for neural networks, 3D RRAM for in-memory computing and GaN-on-Si for power electronics at IEDM 2020, Dec. 12-16. The event will be held virtually because of the coronavirus pandemic.Institute scientists are lead authors on four papers and contributing authors on five more that will be presented during the conference.
WTC - Congress center 5-7, place Robert Schuman - Grenoble, France.
MiNaPAD, the « Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum » will be held in Grenoble, France, at the WTC congress center MiNaPAD is a 2 days conference with an exhibition. The aim of this event is to reinforce the design community (which constitutes the largest share of the semiconductor community in Europe) and the assembly and packaging community:
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.