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Leti Devices Workshop 2022

From 12/4/2022 to 12/4/2022
Nikko Hotel, 222 Mason Street, San Francisco, CA 94 702

Download Leti Devices Workshop presentations


Thank you for attending and making this event successful, filled with valuable networking  opportunities. We hope to see you again next year!

For collaboration requests, please contact Thomas Signamarcheix.



Highly efficient innovative technologies
for More the Moore solutions


Applications for More than Moore require cutting-edge solutions that combine efficient processing and innovative sensing. From curing to sensing, transporting and communicating, numerous factors are driving the roadmap to improve a variety of applications. During the Leti Devices Workshop, CEA-Leti experts will share their visions, innovations and achievements in these fields. Notably, the event will highlight key results in terms of efficient computing (FD-SOI, chiplet, memories), radiofrequency devices and innovative co-integration with sensors.

Speakers

Sébastien Dauvé
CEO, CEA-Leti
Colette Maloney
Head of Unit - Microelectronics & Photonics Industry, European Comission

Head of Silicon Component Division, CEA-Leti


Elisa Vianello
Embedded AI Program Director, CEA-Leti


Fabien Clermidy
Head of Digital Systems and Integrated Circuits Division, CEA-List


System to Technology Transverse Programs Manager, CEA-Leti


Research Engineer in Edge AI, CEA-Leti


VP Strategic Development, CEA-Leti

ancre_program

Workshop Program 



Welcome and workshop with:

  • Chairman
    Thomas Signamarcheix, VP Strategic Development, CEA-Leti

  • Welcome & Introduction
    Sébastien Dauvé, CEO, CEA-Leti

  • Title to be confirmed
    Colette Maloney, Head of Unit - Microelectronics & Photonics Industry, European Comission

  • Efficient neuromorphic computing using non-volatile memories
    Elisa Vianello, Embedded AI Program Director, CEA-Leti

  • Chiplet revolution: solutions for the rapidly changing semiconductor world
    Fabien ClermidyHead of Digital Systems and Integrated Circuits Division, CEA-List

  • FD-SOI: supporting the 6G RF roadmap
    Didier BelotSystem to Technology Transverse Programs Manager, CEA-Leti

  • Ultra Small-Edge AI to smarten sensors
    Emmanuel HardyResearch Engineer in Edge AI, CEA-Leti

  • The path towards scaled and efficient FD-SOI technology
    Olivier Faynot, Head of Silicon Component Division, CEA-Leti




Practical information

Workshop: 5:30 p.m. – 7:00 p.m.

Networking reception: 7:00 p.m. – 9:00 p.m.

Contact : letiinnovationdays@cea.fr  with any questions.

In-person event.


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