innovation for industry
From 2/2/2021 to 2/3/2021
WTC - Congress center 5-7, place Robert Schuman - Grenoble, France.
Dear IMAPS Member, Exhibitor, Speaker,
First of all, we hope that you are all safely at home during these past weeks.
IMAPS France has been closely following the COVID19 situation and, in view the French government decisions, we have decided the following actions regarding MINAPAD and other IMAPS events:
MINAPAD will be postponed to February 2nd and 3rd 2021, and will take place same location of WTC Grenoble, France. We hope that exhibitors will maintain their bookings and speakers maintain their participation in conference program.
We thank you for your understanding for our decision to postpone the event.
If you have any questions, please feel free to contact us.
IMAPS regrets any inconvenience caused by these changes and we would like to thank you for your valuable contribution to all IMAPS events.
In the meantime, please stay safe and healthy.
MiNaPAD, the « Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum » will be held in Grenoble, France, at the WTC congress center on February 2-3, 2021
MiNaPAD is a 2 days conference with an exhibition. The aim of this event is to reinforce the design community (which constitutes the largest share of the semiconductor community in Europe) and the assembly and packaging community:
TSVs, 2,5&3D interposers, wafer level packaging, embedded IC packages, SiP, PoP, MEMS packaging, powerpackaging, advanced substrates, PCB, panel level processes.
Bonding, advanced dicing, flux, cleaning, dispensing, coating technologies, materials & equipment related to assembly manufacturing and business aspects of the industry.
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