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3DVLSI Open Workshop 2019

From 10/15/2019 to 10/15/2019
DoubleTree by Hilton San Jose 2050 Gateway Place - San Jose, CA 95110

​Dear partners,

CEA-Leti, IRT NanoElec and Qualcomm are pleased to invite you for a new 3DVLSI open Workshop dedicated to High Density 3D-IC and CoolCubeTM (Monolithic/Sequential 3D) technologies.

The workshop held:

  • Tuesday morning October 15th, 2019 (date to be confirmed)

  • At the DoubleTree by Hilton, 2050 Gateway Place - San Jose, CA 95110

The event is organized as a satellite event of the IEEE 2019 S3S conference to be held at the same location from October 14th to 17th, 2019.

The 3DVLSI open Workshop project's goals include building a complete ecosystem that takes the technology from design to fabrication.

A first 3DVLSI open Workshop was organized in San Diego back in 2014. Since then, we have seen presentations from Qualcomm, Applied Materials, ARM, Atrenta, Cadence, CEA-Leti, GeorgiaTech, Global Foundries, HPE, Intel, Mentor Graphics, TSMC and many more…

Now, the Workshop has become a forum for industrial partners and ecosystem to share research & development progress in making innovative High Density 3D technologies a truly feasible path towards 3DVLSI industrialization for reliable and cost effective products.

Registration – the event is free - is now open, please just return a mail to any of the organizer with your wish to participate and you will be in.  

We are looking forward to welcoming you again.

Séverine CHERAMY
3D business developer
Head of Microelectronics
Rashid ATTAR
Head of ASIC and Hardware R&D
Qualcomm Corporate Research
Senior Staff Engineer
Qualcomm Technology Inc.
​08:00am     Workshop Opening
​Opening Remarks
3D High Density: Which Technology? Wich Application?
  • CEA-Leti, Severine Cheramy, 3D Business Development
​CEA-Leti in the Chiplet's Race: Status and Strategy
  • CEA-Leti, Sébastien Thuriès, Design Scientist
Designing Heterogeneous Chips With zGlue
  • zGlue, Jawad Nasrullah
Advanced 3D Technologies for the Smart Image Sensors
  • STMicroelectronics, François Guyader
10:10am     Break
Die to Wafer Hybrid Bonding Equipment from R&D to HVM Production
  • SET Smart Equipment Technology, Pascal Metzger
​Electroplating Innovations to Support Next Generation Advanced Packaging Solutions
  • LAM Research, Stephen Banik
3D Integration Challenges and Benefits in our Ultra Low Digital Implementation Platform Nitro-SoC
  • Mentor A Siemens Business, Kristian Zoerhoff
Density Scaling Enabled by Recent Advances in Hybrid Bonding and Fusion Bonding Technology
  • EV Group, Karine Abadie
Advanced Processing Technologies Enabling 3D VLSI Integration
  • APPLIED MATERIAL, Manish Hemkar
​13:00pm      End of the Workshop & Lunch

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