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Highly secure packaging for off-the-shelf & future ICs
ChaXa addresses hardware security risks for off-the-shelf & future ICs.
This patented CEA-Leti technology combines active and passive shielding for a single device against physical attacks. Ferrite particles are deposited on the IC's surface and are associated to an active/passive probe system, creating a magnetic barrier against EM attacks and allowing:
Finally, ChaXa ensures its own protection by detecting any distortion of the ferromagnetic shielding layer.
CEA-Leti's teams are investigating about an in-house design of smart packaging using a new 3D laser printing system integrating powder (ferrite particles) and a polymer. This contributes to reducing the cost of having a secure packaging.
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.