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Press Coverage

Press Coverage

Published on 27 February 2017

  
  
  
  
3/30/2017“Leti Marks 50th Anniversary with Events Across the Globe”Microwave JournalRead the article
3/30/2017“Photonics21 meet learns of pilot lines progress”Optics.orgRead the article
3/28/2017“Leti and Horiba Scientific to Host April 4 Webinar to Show Ultrafast Performance of New Characterization Tool”Microwave JournalRead the article
3/27/2017“3D integration technology for high-density/high-performance ICs” (page 42)Chip Scale Review print edition Read the article
3/23/2017“Ongoing Sensor Work - Reports from ISSCC”EE JournalRead the article
3/23/2017“Leti Presented Advances in Propagation Modelling and Antenna Design at EuCAP 2017”Microwave JournalRead the article
3/14/2017“Leti releases open-source IoT integration framework”EE Time EuropeRead the article
3/13/2017“Light Is the Ultimate Medium for High-Speed Communications”EuroPhotonicsRead the article
3/9/2017“Sensor Fusion - Real Time Embedded Data Fusion for Automated Vehicles”inVISIONRead the article
3/1/2017“European SEMI Award honors advanced packaging technologists”Solid State TechnologyRead the article
2/28/2017“Shining Light through the Backside - A Hybrid Laser that Plays Nice with CMOS”EE JournalRead the article
2/23/2017“Leti to Present Latest R&D Results on Three Alternatives to EUV And 193nm Lithography at SPIE Meeting In US”AZO MaterialsRead the article
2/23/2017“Innovation in the diagnosis of breast cancer – the SOLUS project”Health Care Business Euro NewsRead the article
2/16/2017“Micro LED record claimed as Photonics West”Electronics WeeklyRead the article
2/16/2017“No 5G without new technology!”RCR WirelessRead the article
2/13/2017“New Memories and Architecture Ahead”Semiconductor EngineeringRead the article
2/10/2017“16 Views of ISSCC”EE TimesRead the article
2/6/2017“Object-Detection Becomes Wearable”EE TimesRead the article
1/24/2017“Silicon photonics to meet communication needs”“Silicon photonics to meet communication needs”Read the article
1/23/2017“What’s Next For Transistors And Systems - New FETs, qubits, neuromorphic approaches, and advanced packaging”semiengineering.comRead the article
1/17/2017« 5G radio on trial in France »EEtimesRead the article
1/13/2017“Biggest Robo-Car Roadblock Is Human - CES 2017 Automotive Recap”EETimesRead the article
1/12/2017 “CES 2017: Leti, the biggest little organization you never should have heard of”embedded-computing.comRead the article
1/10/2017“Leti to trial new multicarrier waveform for 5G networks”telecompaper.comRead the article
1/9/2017« CES 2017: Bike-pedal power meter brings pro tools to amature cyclists”embedded-computing.comRead the article
1/4/2017« CES 2017: Leti says RELAX with new EEG wearable »embedded-computing.comRead the article
1/4/2017“Who’s ready to jump into a self-driving car?”embedded-computing.comRead the article
12/22/2016“The Race for AI Chips Begins - CEA to open source benchmarking tools”EETimesRead the article
12/22/2016“9 Views of IEDM - A call to seek what lies beyond Moore’s law”EETimes Read the article
12/21/2016“IEDM 2016 – Marie Semeria Leti Interview »www.semiwiki.comRead the article
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