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Leti is proud to announce that Leti engineer Perceval Coudrain, working on 3D integration and advanced packaging, has received the Best Paper Award at the 69th ECTC Conference in May 2019 for his paper entitled "Active Interposer Technology for Chiplet-Based Advanced 3D System Architectures".
Large multi-core 3D systems with multiple chiplets integrated on an active silicon interposer have been proposed to support High Performance Computing (HPC) applications. Using fine-pitch 3D interconnects, chip-to-chip bandwidth has been increased and overall power consumption has been reduced. A chiplet approach allows optimization of industrial yield through smaller dies and reusable IP blocks. While chiplet partitioning is already widespread on passive organic and silicon interposers, its combination with active circuits has not yet been reported. An active interposer allows intelligent features to be added to the final 3D system, such as advanced network-on-chip (NoC) interconnects, fast I/Os for off-chip communication, embedded power management and system-on-chip (SoC) infrastructure. This paper details the first successful integration of chiplets on a fully packaged and tested active silicon interposer with state-of-the-art, 20 µm-pitch, 3D interconnects.
Read the best session papier
Active Interposer Technology for Chiplet-Based Advanced 3D System Architectures
Perceval Coudrain, Jean Charbonnier, Arnaud Garnier, Pascal Vivet, Rémi Vélard, Andrea Vinci, Fabienne Ponthenier, Alexis Farcy, Roselyne Segaud, Pascal Chausse, Lucile Arnaud, Didier Lattard, Eric Guthmuller, Giovanni Romano, Alain Gueugnot, Frédéric Berger, Jérôme Beltritti, Therry Mourier, Mathilde Gottardi, Stéphane Minoret, Céline Ribière, Gilles Romero, Pierre-Emile Philip, Yorrick Exbrayat, Daniel Scevola, Didier Campos, Maxime Argoud, Nacima Allouti, Raphaël Eleouet, César Fuguet Tortolero, Christophe Aumont, Denis Dutoit, Corinne Legalland, Jean Michailos, Séverine Chéramy, Gilles Simon - CEA LETI
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.