innovation for industry
Workshop in the frame of the 3DAM European ECSEL ProjectRegistration & Information via YURPLAN, registration deadline March 8th Program: Click here
As nano-electronics, technology is moving beyond the boundaries of (strained) silicon in planar or finFETs, new 3D device architectures and new materials bring major metrology and characterization challenges which cannot be met by pushing the present techniques to their limits. 3DAM "3D Advanced Metrology and materials for advanced devices" is an EU-funded pathfinding and assessment project focusing on innovations and progress in metrology and characterization related to the latest generation of 3D front-end of line (FEOL) and back-end of line (BEOL) structures (fins, nanowires, TSVs) as well as 2D materials :
• Dimensional metrology: 3D-SPM, CD-SEM, OCD• Structural analysis: Electron Tomography, PL & CL, SHG, GHz-SAM, X-ray NanoCT• Compositional/dopant analysis: SIMS, APT, STEM-EDX and EELS, IRR, Raman, HRXRD• Carrier distribution and mobility: 3D-SSRM, micro-multi-point probes, THz spectroscopy• Strain and stress: HRXRD, Raman, Precession Electron Diffraction in a TEM
The goal of this workshop is to disseminate the results of the projects to the public. The combination with the insights and learnings from experts will make this one-day workshop an up-to-date overview of the most recent advances in the analytical techniques and diagnostic capabilities essential for technology development.
Keynote Speakers:Dr. Maud Vinet (LETI)Prof. Dr. Ehrenfried Zschech (Fraunhofer Institute)Invited Speakers:Dr. Delphine Le Cunff (ST Microelectronics)Dr. Zineb Saghi (LETI)Dr. Igor Turovets (NOVA)
Committee Co-Chairs:Dr. Vincent Delaye (LETI)Dr. Laurens Kwakman (Thermo Fisher Scientific)
Registration & Information via YURPLAN , registration deadline March 8th
Maison Minatec, 3 Parvis Louis Néel, 38000 Grenoble, France.
This Conference will gather together all scientists and engineers working in the field of new materials and advanced nanoscale devices.
2050 Gateway Place, San Jose, California, 95110, USA.
CEA Leti, Minatec Campus, Grenoble, France.
Deep Tech for Edge Artificial Intelligence
The world won’t wait for the Cloud… neither should you. Distributed intelligence everywhere is the next big thing for industry and society, and IT'S TIME TO STEP IN.
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.