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Workshop in the frame of the 3DAM European ECSEL Project

The 3/15/2019
Grenoble, France

Workshop in the frame of the 3DAM European ECSEL Project

Registration & Information via YURPLAN, registration deadline March 8th
Program: Click here

As nano-electronics, technology is moving beyond the boundaries of (strained) silicon in planar or finFETs, new 3D device architectures and new materials bring major metrology and characterization challenges which cannot be met by pushing the present techniques to their limits. 3DAM "3D Advanced Metrology and materials for advanced devices" is an EU-funded pathfinding and assessment project focusing on innovations and progress in metrology and characterization related to the latest generation of 3D front-end of line (FEOL) and back-end of line (BEOL) structures (fins, nanowires, TSVs) as well as 2D materials :

Dimensional metrology: 3D-SPM, CD-SEM, OCD
Structural analysis: Electron Tomography, PL & CL, SHG, GHz-SAM, X-ray NanoCT
Compositional/dopant analysis: SIMS, APT, STEM-EDX and EELS, IRR, Raman, HRXRD
Carrier distribution and mobility: 3D-SSRM, micro-multi-point probes, THz spectroscopy
Strain and stress: HRXRD, Raman, Precession Electron Diffraction in a TEM

The goal of this workshop is to disseminate the results of the projects to the public. The combination with the insights and learnings from experts will make this one-day workshop an up-to-date overview of the most recent advances in the analytical techniques and diagnostic capabilities essential for technology development.

Keynote Speakers:
Dr. Maud Vinet (LETI)
Prof. Dr. Ehrenfried Zschech (Fraunhofer Institute)

Invited Speakers:
Dr. Delphine Le Cunff (ST Microelectronics)
Dr. Zineb Saghi (LETI)
Dr. Igor Turovets (NOVA)

Committee Co-Chairs:
Dr. Vincent Delaye
Dr. Laurens Kwakman (Thermo Fisher Scientific)

Registration & Information via YURPLAN , registration deadline March 8th

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