innovation for industry
Workshop in the frame of the 3DAM European ECSEL Project
CL & TEM Correlation on ingaas samples (8017Ko)
Registration & Information via YURPLAN, registration deadline March 8th Program: Click here
As nano-electronics, technology is moving beyond the boundaries of (strained) silicon in planar or finFETs, new 3D device architectures and new materials bring major metrology and characterization challenges which cannot be met by pushing the present techniques to their limits. 3DAM "3D Advanced Metrology and materials for advanced devices" is an EU-funded pathfinding and assessment project focusing on innovations and progress in metrology and characterization related to the latest generation of 3D front-end of line (FEOL) and back-end of line (BEOL) structures (fins, nanowires, TSVs) as well as 2D materials :
• Dimensional metrology: 3D-SPM, CD-SEM, OCD• Structural analysis: Electron Tomography, PL & CL, SHG, GHz-SAM, X-ray NanoCT• Compositional/dopant analysis: SIMS, APT, STEM-EDX and EELS, IRR, Raman, HRXRD• Carrier distribution and mobility: 3D-SSRM, micro-multi-point probes, THz spectroscopy• Strain and stress: HRXRD, Raman, Precession Electron Diffraction in a TEM
The goal of this workshop is to disseminate the results of the projects to the public. The combination with the insights and learnings from experts will make this one-day workshop an up-to-date overview of the most recent advances in the analytical techniques and diagnostic capabilities essential for technology development.
Keynote Speakers:Dr. Maud Vinet (LETI)Prof. Dr. Ehrenfried Zschech (Fraunhofer Institute)Invited Speakers:Dr. Delphine Le Cunff (ST Microelectronics)Dr. Zineb Saghi (LETI)Dr. Igor Turovets (NOVA)
Committee Co-Chairs:Dr. Vincent Delaye (LETI)Dr. Laurens Kwakman (Thermo Fisher Scientific)
Registration & Information via YURPLAN , registration deadline March 8th
Las Vegas, USA
CES 2020 : CEA-Leti to exhibit at CES Las Vegas on January 7–10
The Consumer Electronics Show (CES) in Las Vegas is the world's largest showcase for high-tech innovations.
It has become the not-to-be missed international event for the digital and high-tech industries. The next CES will be held on January 7–10, 2020. This year, CEAs team and its startups, show you their solutions for the future of mobility at Eureka Park booth # 50463.
San Francisco, Moscone Center, California, United States.
Join CEA-Leti’s at Photonics West from Feb 4-6, 2020, San Francisco, Moscone Center, French Pavilion, booth 857/957.
San Francisco W-hotel, San Francisco, California, United States.
Leti organizea workshop "Disruptive photonics concepts for new applications & markets" at the San Francisco W-hotel, on Feb. 5th 2020, at 5:15 p.m. during Photonics West 2019.
Join us to discuss the new visions, directions and paradigms on photonics technologies for a broad range of applications, including sensing and quantum technologies.
The purpose of this workshop is to illustrate how Leti can facilitate widespread photonics adoption from high-end to mass-market applications through miniaturization and integration.
Maison MINATEC 3 parvis Louis Néel, 38054 Grenoble
The 10th edition of the JNRSE – « National Days on Energy Harvesting and Storage » will take place on 27-28 May 2020 in Grenoble, France, organized by CEA-Leti and TIMA.
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.