innovation for industry
Workshop in the frame of the 3DAM European ECSEL Project
CL & TEM Correlation on ingaas samples (8017Ko)
Registration & Information via YURPLAN, registration deadline March 8th Program: Click here
As nano-electronics, technology is moving beyond the boundaries of (strained) silicon in planar or finFETs, new 3D device architectures and new materials bring major metrology and characterization challenges which cannot be met by pushing the present techniques to their limits. 3DAM "3D Advanced Metrology and materials for advanced devices" is an EU-funded pathfinding and assessment project focusing on innovations and progress in metrology and characterization related to the latest generation of 3D front-end of line (FEOL) and back-end of line (BEOL) structures (fins, nanowires, TSVs) as well as 2D materials :
• Dimensional metrology: 3D-SPM, CD-SEM, OCD• Structural analysis: Electron Tomography, PL & CL, SHG, GHz-SAM, X-ray NanoCT• Compositional/dopant analysis: SIMS, APT, STEM-EDX and EELS, IRR, Raman, HRXRD• Carrier distribution and mobility: 3D-SSRM, micro-multi-point probes, THz spectroscopy• Strain and stress: HRXRD, Raman, Precession Electron Diffraction in a TEM
The goal of this workshop is to disseminate the results of the projects to the public. The combination with the insights and learnings from experts will make this one-day workshop an up-to-date overview of the most recent advances in the analytical techniques and diagnostic capabilities essential for technology development.
Keynote Speakers:Dr. Maud Vinet (LETI)Prof. Dr. Ehrenfried Zschech (Fraunhofer Institute)Invited Speakers:Dr. Delphine Le Cunff (ST Microelectronics)Dr. Zineb Saghi (LETI)Dr. Igor Turovets (NOVA)
Committee Co-Chairs:Dr. Vincent Delaye (LETI)Dr. Laurens Kwakman (Thermo Fisher Scientific)
Registration & Information via YURPLAN , registration deadline March 8th
Palazzo di Toppo Wassermann, Università degli Studi di Udine, Udine, Italy.
Leti is pleased to offer a workshop on "Advanced Simulations for Emerging Non-Volatile Memory Technologies" during the 2019 IEEE SISPAD conference. FREE REGISTRATION. As an official satellite event of the IEEE SISPAD conference, the workshop will held on Tuesday, September 3rd, from 5:00 pm to 7:30 pm, Palazzo di Toppo Wassermann, Università degli Studi di Udine, Udine, Italy.
CEA Leti, Minatec Campus, 3 Parvis Louis Néel, 38054 Grenoble, France.
E\PCOS conference brings the phase change community together to discuss the latest R&D available in that specific area and their potential applications.
Parvis des sciences, Grenoble, France
For the twelfth consecutive year, the GIANT campus and its partners in Grenoble are mobilizing and organizing the 2019 Science Fair: Saturday, October 12 for the general public free entry and from October 10 to 11 for schoolchildren in Minatec, Parvis Louis Néel in Grenoble.
Espace Champerret, Paris, France
Looking for an R&D partner to get started on your innovation project or bring your project to maturity?
RENDEZ-VOUS CARNOT 2019 is made for you! This event brings together 38 French research institutes dedicated to large, medium and small enterprises. Join Leti Booth and learn more about the institute R&D offer for industry.
Meet Leti and his partner VNano at CPhI and discover ou partnership on Lipidots® technology, versatile and biocompatible lipid-based delivery system nanoparticles for bio-medical applications.
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.