innovation for industry
Workshop in the frame of the 3DAM European ECSEL Project
CL & TEM Correlation on ingaas samples (8017Ko)
Registration & Information via YURPLAN, registration deadline March 8th Program: Click here
As nano-electronics, technology is moving beyond the boundaries of (strained) silicon in planar or finFETs, new 3D device architectures and new materials bring major metrology and characterization challenges which cannot be met by pushing the present techniques to their limits. 3DAM "3D Advanced Metrology and materials for advanced devices" is an EU-funded pathfinding and assessment project focusing on innovations and progress in metrology and characterization related to the latest generation of 3D front-end of line (FEOL) and back-end of line (BEOL) structures (fins, nanowires, TSVs) as well as 2D materials :
• Dimensional metrology: 3D-SPM, CD-SEM, OCD• Structural analysis: Electron Tomography, PL & CL, SHG, GHz-SAM, X-ray NanoCT• Compositional/dopant analysis: SIMS, APT, STEM-EDX and EELS, IRR, Raman, HRXRD• Carrier distribution and mobility: 3D-SSRM, micro-multi-point probes, THz spectroscopy• Strain and stress: HRXRD, Raman, Precession Electron Diffraction in a TEM
The goal of this workshop is to disseminate the results of the projects to the public. The combination with the insights and learnings from experts will make this one-day workshop an up-to-date overview of the most recent advances in the analytical techniques and diagnostic capabilities essential for technology development.
Keynote Speakers:Dr. Maud Vinet (LETI)Prof. Dr. Ehrenfried Zschech (Fraunhofer Institute)Invited Speakers:Dr. Delphine Le Cunff (ST Microelectronics)Dr. Zineb Saghi (LETI)Dr. Igor Turovets (NOVA)
Committee Co-Chairs:Dr. Vincent Delaye (LETI)Dr. Laurens Kwakman (Thermo Fisher Scientific)
Registration & Information via YURPLAN , registration deadline March 8th
Si vous souhaitez faire une demande de cofinancement, le support technique et d’innovation de DigiFed n’oubliez pas d’assister à la série de webinaires où vous trouverez tous les détails concernant le deuxième appel ouvert.
Event | Agenda |
CEA-Leti and Néel Institute are co-organising the GDR MecaQ,
A 2 hour digital event to boost your innovation and chase the next big ideas. Hear experts discuss the future of sensors and data maximzation, followed by interactive panel discussion. Unable to attend the live sessions ?
Feel free to sign up anyway, as all registrants will be sent a link to a recording of the event
Espace Champerret, Paris, France
Looking for an R&D partner to get started on your innovation project or bring your project to maturity?
RENDEZ-VOUS CARNOT 2020 is made for you! This event brings together 38 French research institutes dedicated to large, medium and small enterprises. Join Leti Booth and learn more about the institute R&D offer for industry.
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.