innovation for industry
From 5/28/2019 to 5/31/2019
Las Vegas, NV, USA.
Join Leti at booth 215 to discuss the institute latest 3D and packaging achievements for power electronics, high performance computing, RF and imagers applications. Recent work on flex, thermal management, 3DIC and bonding will also be presented.
If you've missed the CES 2019 show, Leti will bring for the last time this year in Vegas its latest demonstration featuring a curved image sensor.
will present 10 papers and 1 poster:
Program & Registration :
WTC - Congress center 5-7, place Robert Schuman - Grenoble, France.
MiNaPAD, the « Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum » will be held in Grenoble, France, at the WTC congress center on May 27-28, 2020
MiNaPAD is a 2 days conference with an exhibition. The aim of this event is to reinforce the design community (which constitutes the largest share of the semiconductor community in Europe) and the assembly and packaging community:
3 parvis Louis Néel 38054 Grenoble cedex 9 - MINATEC - Grenoble, France.
Are you ready to Embrace the World ?
Ever-increasing demands and expectations for semiconductor technology are matched only by the opportunities they present throughout the supply chain – and for end users. Next summer, CEA-Leti will offer a preview of what is in store for the next tech generation that will drive our future.
Explore coming innovations in semiconductors that will enable smart sensing, local processing, haptics, advanced imaging, smart power management, and new communication technologies.
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.