innovation for industry
From 5/30/2017 to 6/2/2017
Lake Buena Vista, Florida USA
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the Components, Packaging and Manufacturing Technology (CPMT) Society of the IEEE.
Santa Clara convention Center / Santa Clara / CA
Espace Champerret, Paris - France
Parvis des sciences, Grenoble France
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.