innovation for industry
From 9/14/2020 to 9/14/2020
Minatec, Grenoble, France
ESSDERC - ESSCIRC, is the major European scientific conference in the field of microelectronics, offering presentations and discussions on recent advances in semiconductor devices and circuits. This conference brings together more than 600 students, researchers, experts, R&D engineers and technical directors from around the world with both industrial and academic profiles.
The level of integration for systems-on-chip design is increasing rapidly. Thus, more than ever, interaction between technicians, experts and designers of integrated systems and circuits is necessary.
Unfortunately, faced with the global pandemic situation, the ESSxxRC2020 Grenoble organizing committee and the ESSCIRC-ESSDERC steering committee decided to propose a new format for the conference.
Conference: Provisional dates from September 6 to 9, 2021 in Grenoble, Minatec
Submission of articles for April 19, 2021
Virtual educational event: September 14, 200
More information on website
Parvis des sciences, Grenoble, France
For the twelfth consecutive year, the GIANT campus and its partners in Grenoble are mobilizing and organizing the 2019 Science Fair: Saturday, October 12 for the general public free entry and from October 10 to 11 for schoolchildren in Minatec, Parvis Louis Néel in Grenoble.
3 parvis Louis Néel 38054 Grenoble cedex 9 - MINATEC - Grenoble, France.
Are you ready to Embrace the World ?
Ever-increasing demands and expectations for semiconductor technology are matched only by the opportunities they present throughout the supply chain – and for end users. Next summer, CEA-Leti will offer a preview of what is in store for the next tech generation that will drive our future.
Explore coming innovations in semiconductors that will enable smart sensing, local processing, haptics, advanced imaging, smart power management, and new communication technologies.
WTC - Congress center 5-7, place Robert Schuman - Grenoble, France.
MiNaPAD, the « Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum » will be held in Grenoble, France, at the WTC congress center MiNaPAD is a 2 days conference with an exhibition. The aim of this event is to reinforce the design community (which constitutes the largest share of the semiconductor community in Europe) and the assembly and packaging community:
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.