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CEA-Leti @MinaPAD-IMAPS

From 5/27/2020 to 6/28/2020
WTC - Congress center 5-7, place Robert Schuman - Grenoble, France.

MinaPAD Forum 2020

MiNaPAD, the « Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum » will be held in Grenoble, France, at the WTC congress center on May 27-28, 2020

MiNaPAD is a 2 days conference with an exhibition. The aim of this event is to reinforce the design community (which constitutes the largest share of the semiconductor community in Europe) and the assembly and packaging community:

  • Parallel technical sessions
  • An exhibition
  • Additional  technical events (May 21, 2019)

Extended abstracts (2 pages maximum, including graphs, pictures, …) are requested on the following topics :

  • Advanced packaging: 

TSVs, 2,5&3D interposers, wafer level packaging, embedded IC packages, SiP, PoP, MEMS packaging, powerpackaging, advanced substrates, PCB, panel level processes.

  • Assembly andmanufacturing technologies 

Bonding, advanced dicing, flux, cleaning, dispensing, coating technologies, materials & equipment related to assembly manufacturing and business aspects of the industry.

  • Advanced interconnections:
Flip-chip including ultra-fine pitches approaches, interconnections, IMC studies, bumping techniques (solder bumps,Cupillars,...) disruptive interconnections,optical connections.

  • Emerging & sustainabletechnologies & applications
Flexible/stretchable packaging, nanomaterial for interconnections, green/bio and sustainable technologies for packaging, additive manufacturing,Nanomanufacturing.


  • Innovative Materials equipment's andprocesses
3D materials, conductive & non-conductive adhesives, underfill, molding, disruptive solder alloys, thermal interface. Innovative equipment for assembly & packaging.


  • Reliability & tests
Applied reliability for LED, Displays, IoT, MEMS, memories, medical devices, autonomous vehicles.Lifemodels,failure analysis techniques & characterizations.


  • Imaging & photonics assembly technologies
Assembly & packaging technologies for optical and photonics applications: imaging, displays, silicon photonics, optical sensors, high energy physics and medical imaging.

  • Thermal/mechanical simulation and characterization
Components, boards & system level modelling for: interconnections, interposers, substrates, WLP & embedded packages, powermodules, optical packaging, RF and MEMS.


  • Abstract must address to : Imaps France
  • Extended abstracts submission date : from today to the 14th February 2020
  • Your submission must include the mailing address, business phone number and email address and the content must be without commercial information.
  • Notification of acceptance: Authors will be notified of paper acceptance with instructions for presentation before March 16h, 2020
  • Presentations: Presentation shouldbeready one daybeforethe workshop and supplyto the chairwomenor chairmenof your session.




Practical information

Organization :



General chair: Alexandre Val (Valeo)
Technical Chairs: Jean-Luc Diot(IMAPS),
Michel Garnier & Romain Coffy (ST Microelectronics), 
David Henry & Gilles Simon (CEA-LETI).



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