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CEA-Leti @MinaPAD-IMAPS- Postponed to 2021

From 2/2/2021 to 2/3/2021
WTC - Congress center 5-7, place Robert Schuman - Grenoble, France.

MinaPAD Forum 

Dear IMAPS Member, Exhibitor, Speaker, 

First of all, we hope that you are all safely at home during these past weeks.

IMAPS France has been closely following the COVID19 situation and, in view the French government decisions, we have decided the following actions regarding MINAPAD and other IMAPS events:

MINAPAD will be postponed to February 2nd and 3rd 2021, and will take place same location of WTC Grenoble, France. We hope that exhibitors will maintain their bookings and speakers maintain their participation in conference program.

We thank you for your understanding for our decision to postpone the event.

If you have any questions, please feel free to contact us.


Regarding all other IMAPS events: 

  • Micro/Nano Power Workshop (November 28th at Tours) will remain unchanged.
  • Thermal Management Workshop has been scheduled on 19th and 20th May 2021 at the same venue MERCURE LA ROCHELLE. We will keep you informed on final dates with poster, advertising banner and Call for papers.

 

IMAPS regrets any inconvenience caused by these changes and we would like to thank you for your valuable contribution to all IMAPS events.

 

In the meantime, please stay safe and healthy.

>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>>

MiNaPAD, the « Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum » will be held in Grenoble, France, at the WTC congress center on February 2-3, 2021

MiNaPAD is a 2 days conference with an exhibition. The aim of this event is to reinforce the design community (which constitutes the largest share of the semiconductor community in Europe) and the assembly and packaging community:

  • Parallel technical sessions
  • An exhibition
  • Additional technical events 

Extended abstracts (2 pages maximum, including graphs, pictures, …) are requested on the following topics :

  • Advanced packaging: 

TSVs, 2,5&3D interposers, wafer level packaging, embedded IC packages, SiP, PoP, MEMS packaging, powerpackaging, advanced substrates, PCB, panel level processes.

  • Assembly andmanufacturing technologies 

Bonding, advanced dicing, flux, cleaning, dispensing, coating technologies, materials & equipment related to assembly manufacturing and business aspects of the industry.

  • Advanced interconnections:
Flip-chip including ultra-fine pitches approaches, interconnections, IMC studies, bumping techniques (solder bumps,Cupillars,...) disruptive interconnections,optical connections.

  • Emerging & sustainabletechnologies & applications
Flexible/stretchable packaging, nanomaterial for interconnections, green/bio and sustainable technologies for packaging, additive manufacturing,Nanomanufacturing.


  • Innovative Materials equipment's andprocesses
3D materials, conductive & non-conductive adhesives, underfill, molding, disruptive solder alloys, thermal interface. Innovative equipment for assembly & packaging.


  • Reliability & tests
Applied reliability for LED, Displays, IoT, MEMS, memories, medical devices, autonomous vehicles.Lifemodels,failure analysis techniques & characterizations.


  • Imaging & photonics assembly technologies
Assembly & packaging technologies for optical and photonics applications: imaging, displays, silicon photonics, optical sensors, high energy physics and medical imaging.

  • Thermal/mechanical simulation and characterization
Components, boards & system level modelling for: interconnections, interposers, substrates, WLP & embedded packages, powermodules, optical packaging, RF and MEMS.


  • Abstract must address to : Imaps France
  • Extended abstracts submission date : from today to the 14th February 2020
  • Your submission must include the mailing address, business phone number and email address and the content must be without commercial information.
  • Notification of acceptance: Authors will be notified of paper acceptance with instructions for presentation before March 16h, 2020
  • Presentations: Presentation shouldbeready one daybeforethe workshop and supplyto the chairwomenor chairmenof your session.





Practical information

Organization :



General chair: Alexandre Val (Valeo)
Technical Chairs: Jean-Luc Diot(IMAPS),
Michel Garnier & Romain Coffy (ST Microelectronics), 
David Henry & Gilles Simon (CEA-LETI).



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