innovation for industry
From 10/16/2018 to 10/16/2018
San Francisco, USA
Leti, IRT NanoElec and Qualcomm are pleased to invite you to the 3DVLSI open workshop dedicated to High Density 3D-IC and CoolCubeTM (Monolithic/Sequential 3D) technologies. The event is organized as a satellite event of the IEEE 2018 S3S conference and will take place on Tuesday, Oct 16, 2018.
The 3DVLSI open workshop project's goals include building a complete ecosystem that takes the technology from design to fabrication.
A first 3DVLSI open workshop was organized in San Diego back in 2014. Since then, we have seen presentations from Applied Materials, ARM, Atrenta, Cadence, CEA-Leti, GeorgiaTech, Globalfoundries, HPE, Intel, Mentor Graphics, Monolithic3D, Qualcomm, Stanford University, TSMC and many more…
Now, the workshop has become a forum for industrial partners and ecosystem to share research & development progress in making innovative High Density 3D technologies a truly feasible path towards 3DVLSI industrialization for reliable and cost effective products.
3D technologies and applicationsSeverine
Cheramy, CEA-Leti, 3D Business development
3DVLSI CoolCube™ MPW & design roadmapSébastien Thuriès, CEA-Leti, Head of Digital Design
RETINE: A 3D application for parallel Imaging Fabien Clermidy, CEA-Leti, Head of Digital Design
Title to be definedKambiz
Sequential 3D Technology: from more Moore applications to technology diversificationAnne Vandooren, IMEC
Trends in 2.5D/3D High Density Advanced Package Verification Zain Ali, Mentor, A Siemens Business
Low thermal budget technologies for 3D-VLSIPapo Chen, APPLIED MATERIALS
Die-to-Wafer equipment for direct hybrid bonding in productionPascal
Metzger, SET Smart Equipment Technology
Minatec, Grenoble, France
Parvis des sciences, Grenoble, France
For the twelfth consecutive year, the GIANT campus and its partners in Grenoble are mobilizing and organizing the 2019 Science Fair: Saturday, October 12 for the general public free entry and from October 10 to 11 for schoolchildren in Minatec, Parvis Louis Néel in Grenoble.
3 parvis Louis Néel 38054 Grenoble cedex 9 - MINATEC - Grenoble, France.
Are you ready to Embrace the World ?
Ever-increasing demands and expectations for semiconductor technology are matched only by the opportunities they present throughout the supply chain – and for end users. Next summer, CEA-Leti will offer a preview of what is in store for the next tech generation that will drive our future.
Explore coming innovations in semiconductors that will enable smart sensing, local processing, haptics, advanced imaging, smart power management, and new communication technologies.
Espace Champerret, Paris, France
Looking for an R&D partner to get started on your innovation project or bring your project to maturity?
RENDEZ-VOUS CARNOT 2020 is made for you! This event brings together 38 French research institutes dedicated to large, medium and small enterprises. Join Leti Booth and learn more about the institute R&D offer for industry.
WTC - Congress center 5-7, place Robert Schuman - Grenoble, France.
MiNaPAD, the « Micro/Nano-Electronics Packaging & Assembly, Design and Manufacturing Forum » will be held in Grenoble, France, at the WTC congress center MiNaPAD is a 2 days conference with an exhibition. The aim of this event is to reinforce the design community (which constitutes the largest share of the semiconductor community in Europe) and the assembly and packaging community:
CEA is a French government-funded technological research organisation in four main areas: low-carbon energies, defense and security, information technologies and health technologies. A prominent player in the European Research Area, it is involved in setting up collaborative projects with many partners around the world.